Matches 1 - 5 out of 5
Match Document Document Title
6204164 Method of making electrical connections to integrated circuit  
In a method of making electrical connections to an integrated chip, an oxide layer is formed on the surface of the chip and a substrate carrying electrical connections. The conductors on the chip...
5230462 Method of soldering a sputtering target to a backing member  
A method of bonding a sputtering target to a backing member or plate for subsequent use in a sputtering operation. A target and a backing plate are first provided and one face of each of the target...
5161729 Package to semiconductor chip active interconnect site method  
Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight...
5121871 Solder extrusion pressure bonding process and bonded products produced thereby  
Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40° C. and 110° C. Process involves interposing a thin layer of a metal...
5066614 Method of manufacturing a leadframe having conductive elements preformed with solder bumps  
Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight...
Matches 1 - 5 out of 5