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7473966 |
Oxide-bypassed lateral high voltage structures and methods
A lateral high-voltage active device structure, in which field-shaping trench electrodes are capacitively coupled to the voltage-withstand region near the source end thereof.
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7466006 |
Structure and method for RESURF diodes with a current diverter
Methods and apparatus are provided for reducing substrate leakage current of lateral RESURF diode devices. The diode device ( 60, 60′, 100 ) comprises first ( 39 ) and second ( 63 ) surface...
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7462541 |
Manufacturing method of semiconductor device
A semiconductor device including a drift layer of a first conductivity type formed on a surface of a semiconductor substrate. A surface of the drift layer has a second area positioned on an outer...
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7449400 |
Method of forming an isolation film in a semiconductor device
The present invention relates to an isolation film in a semiconductor device and method of forming the same. An isolation film is formed in a doped region of a peripheral region, in which the doped...
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7436041 |
Electrostatic discharge protection circuit using a double-triggered silicon controlling rectifier
An ESD protection circuit using a double-triggered silicon controller rectifier (SCR). The double-triggered silicon controller rectifier (SCR) includes N+ diffusion areas, P+ diffusion areas, a...
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7436025 |
Termination structures for super junction devices
A semiconductor device 10 is provided. A first layer 12 has a first dopant type; a second layer 14 is provided over the first layer 12 ; and a third layer 16 is provided over the second...
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7429774 |
Electrostatic discharge (ESD) protection MOS device and ESD circuitry thereof
An NMOS device having protection against electrostatic discharge. The NMOS device includes a P-substrate, a P-epitaxial layer overlying the P-substrate, a P-well in the P-epitaxial layer, an N-well...
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7427795 |
Drain-extended MOS transistors and methods for making the same
Drain-extended MOS transistors (T 1 , T 2 ) and semiconductor devices ( 102 ) are described, as well as fabrication methods ( 202 ) therefor, in which a p-buried layer ( 130 ) is formed prior to...
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7423319 |
LDPMOS structure with enhanced breakdown voltage
A semiconductor structure includes a first well region of a first conductivity type overlying a substrate, a second well region of a second conductivity type opposite the first conductivity type...
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7420245 |
Semiconductor device and method of manufacturing the same
A first semiconductor pillar layer of a first conductivity type is formed on a main surface of a semiconductor substrate of the first conductivity type. A second semiconductor pillar layer of a...
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7414268 |
High voltage silicon carbide MOS-bipolar devices having bi-directional blocking capabilities
Silicon carbide high voltage semiconductor devices and methods of fabricating such devices are provided. The devices include a voltage blocking substrate. Insulated gate bipolar transistors are...
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7411248 |
Vertical unipolar component periphery
A vertical unipolar component formed in a semiconductor substrate, comprising vertical fingers made of a conductive material surrounded with silicon oxide, portions of the substrate being present...
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7378317 |
Superjunction power MOSFET
Methods and apparatus are provided for TMOS devices, comprising multiple N-type source regions, electrically in parallel, located in multiple P-body regions separated by N-type JFET regions at a...
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7372111 |
Semiconductor device with improved breakdown voltage and high current capacity
The superjunction semiconductor device includes a drain drift section, which includes a first alternating conductivity type layer formed of first n-type regions and first p-type regions arranged...
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7372104 |
High voltage CMOS devices
A transistor suitable for high-voltage applications is provided. The transistor is formed on a substrate having a deep well of a first conductivity type. A first well of the first conductivity type...
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7361955 |
High-voltage MOS device with dummy diffusion region
A high-voltage MOS device includes a substrate; a drift ion well formed in the substrate; a first isolation region formed in the drift ion well; a gate electrode formed on the substrate and...
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7348630 |
Semiconductor device for high frequency uses and manufacturing method of the same
The semiconductor device has a semiconductor substrate, gate electrodes formed above the semiconductor substrate, and a pair of impurity diffusion layers formed in a surface layer of the...
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7345340 |
Semiconductor integrated circuit and a semiconductor device
A semiconductor integrated circuit that has a quick response to changes in source/drain electrode voltage having an LDMOS transistor. The transistor has a second conduction type first well region...
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7335949 |
Semiconductor device and method of fabricating the same
A semiconductor device 100 includes an element-forming region having gate electrode 108 formed therein, and a circumferential region formed in the outer circumference of the element-forming...
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7332770 |
Semiconductor device
A semiconductor device of this invention is a vertical power MOSFET having a plurality of first trenches where a trench gate is formed. It has a first column region of a second conductivity type...
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7332756 |
Damascene gate structure with a resistive device
A semiconductor structure having a damascene gate structure and a resistive device on a semiconductor substrate is disclosed. The structure includes a first dielectric layer having a first opening...
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7304356 |
IGBT or like semiconductor device of high voltage-withstanding capability
A multiple-cell insulated-gate-bipolar-transistor chip is disclosed which includes a semiconductor substrate having formed therein a p + -type collector region and an n − -type base region, with...
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7301203 |
Superjunction semiconductor device
In accordance with an embodiment of the invention, a superjunction semiconductor device includes an active region and a termination region surrounding the active region. A central vertical axis of...
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7301202 |
Semiconductor device and method of manufacturing the same
A semiconductor substrate of a first conduction type is provided for serving as a common drain to a plurality of power MISFET cells. A middle semiconductor layer is formed on the semiconductor...
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7282764 |
Semiconductor device
A semiconductor device having high ruggedness is provided. The distance Wm 2 between buried regions, positioned at the bottoms of different base diffusion regions and face each other, is set...
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7279747 |
Semiconductor device, and production method for manufacturing such semiconductor device
A semiconductor device includes a first conductivity type semiconductor substrate. A first conductivity type drift layer is formed on a surface of the first conductivity type semiconductor...
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7253486 |
Field plate transistor with reduced field plate resistance
In one example embodiment, a transistor ( 100 ) is provided. The transistor ( 100 ) comprises a source ( 10 ), a gate ( 30 ), a drain ( 20 ), and a field plate ( 40 ) located between the gate ( 30...
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7253474 |
Quasi-vertical semiconductor component
A quasi-vertical semiconductor component in which, by variation of the layout, the process or the wiring of inner cells, a compensation for a voltage drop along a buried layer is provided in order...
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7244975 |
High-voltage device structure
A high-voltage device structure includes a high-voltage device disposed on a semiconductor substrate. The semiconductor includes an active region and an isolation region, and the high-voltage...
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7224025 |
Isolated LDMOS IC technology
A lateral double diffused metal oxide semiconductor (LDMOS) device includes a gate to control the device, a drain coupled to the gate formed in a well of a first type, a source to form a current...
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7217954 |
Silicon carbide semiconductor device and method for fabricating the same
An inventive semiconductor device is provided with: a silicon carbide substrate 1; an n-type high resistance layer 2; well regions 3 provided in a surface region of the high resistance layer ...
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7211846 |
Transistor having compensation zones enabling a low on-resistance and a high reverse voltage
A semiconductor component includes a semiconductor body having a substrate of a first conduction type and a first layer of a second conduction type that is located above the substrate. A channel...
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7202529 |
Field effect transistor
A field effect transistor includes a substrate having a doping of a first conductivity type, a drain area in the substrate having a doping of a second conductivity type oppposite the first...
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7190027 |
Semiconductor device having high withstand capacity and method for designing the same
A semiconductor device includes a semiconductor substrate, a low concentration region, an intermediate concentration region, the first electrode region, and the second electrode region. The device...
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7187033 |
Drain-extended MOS transistors with diode clamp and methods for making the same
High side extended-drain MOS driver transistors (T 2 ) are presented in which an extended drain ( 108, 156 ) is separated from a first buried layer ( 120 ) by a second buried layer ( 130 ), wherein...
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7176538 |
High voltage MOSFET having doped buried layer
A MOSFET includes an insulated gate electrode on a surface of a semiconductor substrate having an impurity region of first conductivity type therein that extends to the surface. Source and drain...
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7176524 |
Semiconductor device having deep trench charge compensation regions and method
In one embodiment, a semiconductor device is formed in a body of semiconductor material. The semiconductor device includes a charge compensating trench formed in proximity to active portions of the...
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7170109 |
Heterojunction semiconductor device with element isolation structure
A technique enabling to improve element isolation characteristic of a semiconductor device is provided. An element isolation structure is provided in a semiconductor substrate in which a silicon...
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7166890 |
Superjunction device with improved ruggedness
An improved superjunction semiconductor device includes a charged balanced pylon in a body region, where a top of the pylon is large to create slight charge imbalance. A MOSgated structure is...
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7157772 |
Semiconductor device and method of fabricating the same
A gate electrode has an end extended over a part of a LOCOS oxide film, and a source electrode has an end extended further than the end of the gate electrode over a part of the LOCOS oxide film. An...
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7145203 |
Graded-junction high-voltage MOSFET in standard logic CMOS
A high-voltage graded junction LDMOSFET includes a substrate of a first conductivity type, a well of the first conductivity type disposed in the substrate, a first region of a second conductivity...
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7129546 |
Electrostatic discharge protection device
An ESD protection device. The ESD protection device has a substrate; a channel region, a source region, and a drain region. The channel region is formed on a predetermined area of a surface of the...
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7126191 |
Double-diffused semiconductor device
A DMOSFET and a method of fabricating the same, capable of keeping a desirable level of drain voltage resistance and, at the same time, of reducing the drain resistance. In a DMOSFET configured as...
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7126186 |
Compensation component and process for producing the component
A compensation component and a process for production thereof includes a semiconductor body having first and second electrodes, a drift zone disposed therebetween, and areas of a first conductivity...
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7122861 |
Semiconductor device and manufacturing method thereof
The present invention relates to a semiconductor device including a high withstand voltage MOS transistor and a manufacturing method thereof. The semiconductor device according to the present...
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7122860 |
Trench-gate semiconductor devices
A trench-gate semiconductor device, for example a MOSFET or IGBT, includes a semiconductor body ( 20 ) having a drain region ( 4 ) comprising a drain drift region ( 4 a ) and a drain contact region...
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7115946 |
MOS transistor having an offset region
A semiconductor device includes a semiconductor region of a first conductivity type, a drain region of the first conductivity type, an offset region of the first conductivity type, a body region of...
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7098506 |
Semiconductor device and method for fabricating the same
Described is a method for fabricating a semiconductor device having an FET of a trench-gate structure obtained by disposing a conductive layer, which will be a gate, in a trench extended in the...
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7091557 |
Semiconductor component with increased dielectric strength and/or reduced on resistance
The invention relates to a semiconductor component having a first semiconductor zone of a first conduction type, a second semiconductor zone of a second conduction type and a drift zone arranged...
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7091556 |
High voltage drain-extended transistor
The present invention provides, in one embodiment, a transistor ( 100 ). The transistor ( 100 ) comprises a doped semiconductor substrate ( 105 ) and a drain-extended well ( 115 ) having a curved...
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